Interferometric Metrology for Thin and Ultra-thin Compound Semiconductor Structures Mounted on Insulating Carriers
Wojciech Walecki, Frank Wei, Phuc Van, Kevin Lai, Tim Lee, SH Lau, and Ann Koo
Keywords: Wafer Thickness Metrology Ultra-thin Wafers, Test and Reliability
The application of low coherence optical interferometry to measurement of compound semiconductor wafers is discussed. Proposed method allows measurements of free standing an bonded wafers, both doped and semi-insulating.