Interferometric Metrology for Thin and Ultra-thin Compound Semiconductor Structures Mounted on Insulating Carriers

Wojciech Walecki, Frank Wei, Phuc Van, Kevin Lai, Tim Lee, SH Lau, and Ann Koo

Frontier Semiconductor, 1631 North 1st Street, San Jose, CA  95112 fsm100@aol.com; phone: 1-408-452-8898 email: wwalecki@frontiersemi.com

 

Keywords: Wafer Thickness Metrology Ultra-thin Wafers, Test and Reliability

 

Abstract

The application of low coherence optical interferometry to measurement of compound semiconductor wafers is discussed.  Proposed method allows measurements of free standing an bonded wafers, both doped and semi-insulating.

 

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