Through-wafer Via Etch Throughput Improvement in a GaAs Semiconductor Device

Craig Carpenter and Sarah Woolsey

Skyworks Solutions Inc., 20 Sylvan Rd., Woburn, MA  01801

Email: craig.carpenter@skyworksinc.com Phone: (781) 376-3039

 

Keywords : Via, RIE, Throughput, and Back side

 

Abstract:

At Skyworks Solutions throughput of the back side through-wafer via etch process was low because of a high rework rate.  The high rework rate was due to an organic residue blocking the etch.  A process was first developed to remove the residue and then integrated into the via etch process.  The optimized via etch process resulted in a reduction in reworks and a significant increase in process throughput.

 

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