Through-wafer Via Etch Throughput Improvement in a GaAs Semiconductor Device
Craig Carpenter and Sarah Woolsey
Skyworks Solutions Inc.,
Email: firstname.lastname@example.org Phone: (781) 376-3039
Keywords : Via, RIE, Throughput, and Back side
At Skyworks Solutions throughput of the back side through-wafer via etch process was low because of a high rework rate. The high rework rate was due to an organic residue blocking the etch. A process was first developed to remove the residue and then integrated into the via etch process. The optimized via etch process resulted in a reduction in reworks and a significant increase in process throughput.