High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing

John Moore^a, Alexander Smith^a, David Nguyen^b, and Sudhakar Kulkarnic^c

^aGeneral Chemical West, LLC, Electronic Materials Group, 22340 Bert Drive, Hollister, CA 95023

Phone: (831) 630-6202, Email: jmoore@genchemcorp.com, (831) 630-6208, Email: acsmith@genchemcorp.com

^bMicrosemi Corporation, 11861 Western Avenue, Garden Grove, CA 92841

Phone : (714) 372-8327, Email : davidnguyet@microsemi.com

^cIntel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226

Phone: (480) 554-4750, Email: sudhakar.n.kulkarni@intel.com

Keywords: Thermoset, Demount, Planarization, TTV

Abstract

Wafer backside processing steps that include high temperature exposure may now be simplified with the use of a thermally resistant adhesive, Gentak^Ta330. ¹ Processing at temperature of 200^oC and beyond are accepted to include plasma etching, deposition, and the curing of related polymers, such as BCB. ² By combining the thermoset properties of GenTak^TM, there is no need to separate the substrate from the carrier until backside processing is complete. Application and mounting times within 30 minutes, outgassing at <1%, and demount and cleaning in a few hours, qualify this adhesive as an aid to manufacturing

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