Multiple Level Plated gold Intgerconnect for III-V Circuits

Gregg Leslie, Jennifer Wang, Peter Nam, Joy Yamamoto. Raffi Elmadjian, L.J. Lee, Donald Sawdai, Donnell Nguyen, Dino Mensa, Jensen Uyeda, Danny Li and Michale Barsky

Northrop Grumman Space Technolgoy, Redondo Beach, California.  Gregg.Leslie@ngc.com (310) 812-9568

 

Keywords: Intgerconnect, Gold, BCB, Low k

 

Abstract

Performance for III-V circuits is increasingly constrained by the limitations of lift-off type interconnect metal schemes.  Enhancements in device performance will require a silicon style interconnect process with shorter signal routing paths to take full advantage of these improvements.

 

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