Trends in RF & Wireless Packaging

Karlheinz Bock, Jurgen Wolf, Herbert Reichl

Fraunhofer Institute for Reliability and Microintegration, Hansastr. 27d, D-80686 Munich, Germany, bock@izm-m.fhg.de,  phone +49 89 54759 506

 

Keywords: RF&Wireless, EM simulation, packaging, heterointegration, WLP, board, assembly, bumping, housing, semiconductor thinning, flexible substrates, low-cost production and processing, test, reliability, packaging waves

 

Abstract

This paper overviews the RF&Wireless packaging trends and introduces the four major impact areas Methodology and systems modeling, Board, assembly and housing, Prototyping, processing and production, Characterization on hand of real life examples.  As an outview the major present trend of heterointegration and the picture of packaging waves is used to look into near future.

 

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