Thermal Management of High Power Devices
J. Laskar, S. Nuttinck, and S. Pinel
Email: firstname.lastname@example.org – Tel: 404 385 6009
Keywords: power devices, thermal effects, micro-channels
We report in this paper the thermal effects onto the performances of high power microwave transistors. Also, thermal simulation results along with means to optimize the heat dissipation on a wafer level are discussed. Finally we present a novel active thermal management technique using micro-fluidic channels. The simple fabrication process is presented.