The
evolution of interconnect technology for silicon integrated circuitry.
Keith Buchanan
Trikon Technologies, Ringland Way, Newport NP18 2TA.
United Kingdom.
e-mail: keith.buchanan@trikon.com
telephone: +44 (0)1633 414025
Introduction
Silicon integrated circuit interconnect
technology has evolved rapidly, driven by the continual increase in device
functional density. This paper reviews past technology developments and
highlights current innovations such as the use of copper metallisation and low
k dielectrics to overcome device speed limitations. Areas of convergence
between silicon and compound semiconductor interconnect technologies are
discussed and future requirements reviewed.