The evolution of interconnect technology for silicon integrated circuitry.

 

Keith Buchanan

Trikon Technologies, Ringland Way, Newport NP18 2TA. United Kingdom.

e-mail: keith.buchanan@trikon.com telephone: +44 (0)1633 414025

 

Introduction

 

Silicon integrated circuit interconnect technology has evolved rapidly, driven by the continual increase in device functional density. This paper reviews past technology developments and highlights current innovations such as the use of copper metallisation and low k dielectrics to overcome device speed limitations. Areas of convergence between silicon and compound semiconductor interconnect technologies are discussed and future requirements reviewed.

 

              

01C.PDF                 Return to TOC