GaAs MESFET, HEMT and HBT Competition with Advanced Si RF Technologies

The International Conference on
Compound Semiconductor Manufacturing Technology

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P A P E R T I T L E

GaAs MESFET, HEMT and HBT Competition with Advanced Si RF Technologies

A U T H O R / C R E D I T S

Otto Berger
Siemens Semiconductor Group
e-mail: otto.berger@siemens-scg.com http://www.siemens.de/semiconductor/

A B S T R A C T

As one of the major suppliers in the area of High Frequency (HF) components, the Siemens Semiconductor HF Product Division stands for a continuous commitment to innovative Technologies and Products combined with a volume strategy. The Siemens Technology and Product Roadmap is directed to complete RF system solutions and device kits as well as standard and custom specific components in enhanced Si, GaAs and Hetero Materials (SiGe HBT, GaAs HEMT, GaAs HBT). A core competence is the fabrication of RF components in Surface Mounted Technology (SMT). We produce high volume discretes in Si & GaAs, MMICs (Monolithic Microwave IC's) in Si & GaAs, and finally Fast Logic Circuits in enhanced Si technologies.

     GaAs MANTECH, Inc.
     Campus Box 1127
     One Brookings Drive
     St. Louis, MO 63130-4899
     314.935.5575 Info@GaAsMantech.org