P A P E R    T I T L E
Packaging of Ultra-Thin Film GaAs Devices for Increased Thermal Efficiency and High Density MCM's

A U T H O R  /  C R E D I T S
Mike Sickmiller, Alex Pike, Steve Jacobs, Luan Vo, P.
Pete Zampardi*, Gerry Sullivan*, Brian McDermott*
ELO Technologies, Inc., 3205 Ocean Park Blvd. Ste 180
Santa Monica, CA 90405 Phone: (310) 452-6688 Fax: (310) 452-9188
sickmill@ELOtechnologies.com
*Rockwell Science Center, Thousand Oaks, CA
This work was supported by the Air Force Research Labs under Contract #F29601-98-C-0086

A B S T R A C T
A major concern in GaAs and high density MCM packaging is thermal density. Thinning of the GaAs substrate alleviates this problem somewhat, but current thinning techniques are limited to about 100 µm. The thickness of the substrate adversely affects heat sinking as well as requiring long through-substrate vias for electrical interconnection to the backside of the chip.

Using the ELO Packaging Process, the substrate can be thinned to only a few microns. This eliminates the long thermal path, makes vertical interconnects short and easy, and in many cases increases the electrical performance of the device itself through the elimination of substrate parasitics.