150 Companies Represented at 2011 Conference
AFRL |
IBM |
SAFC Hitech |
AGC Electronics America |
IMN Epiphany |
ShinEtsuMicroSi |
Agilent Technologies |
Indian Institute of Technology |
SigmaTech, Inc. |
Air Products |
Infineon Technologies AG |
Simax Lithography |
AIXTRON Inc. |
Infinera |
Sinmat |
ALSI |
INNOViON |
Skyworks Solutions |
AMTECHS CORPORATION |
Intersil Corporation |
Soitec USA, Inc. |
ANADIGICS |
IQE |
Sonata LLC |
Avago Technologies |
Kopin Corporation |
Sony Electronics Inc. |
AxR Tech |
Kyma Technologies |
Sony Semiconductor |
AXT |
LayTec AG |
sp3 Diamond Technology, Inc. |
BAE SYSTEMS |
Lehighton Electronics, Inc. |
SRI International |
Brewer Science Inc. |
M/A-COM Technology Solutions |
Strategy Analytics |
Bridgestone Corporation |
Marubeni America |
Sumika Electronic Materials |
Canadian Space Agency |
Materion |
Sumitomo Electric |
Cascade Microtech |
MicroChem |
SVT Associates |
Centre for Process Innovation |
MicroLink Devices |
Technology Service Corporation |
Centrotherm Thermal Solutions |
MIT |
Teledyne Scientific Company |
CeriTech Global, LLC |
Nanotronics Imaging |
Texas Instruments |
Cobham |
National Chi Nan University |
Toshiba |
Cree Inc. |
National Taiwan University |
Toyota Central RD Labs., Inc. |
Cree, Inc. |
Naval Research Laboratory |
TriQuinr Semiconductor |
Dankook University |
Nitronex Corporation |
UCLA |
DARPA/MTO |
Nor-Cal Products |
UMS GmbH |
Dow Corning |
Northland Capital Markets |
United Mineral and Chemical Corporation |
Dowa International Corporation |
Northrop Grumman Corporation |
United Monolithic Semiconductors |
Eastman Chemical Company |
NOVASiC |
Univ. of Florida |
ECE |
NSWC Crane |
Univ. of Notre Dame |
EJL Wireless Research LLC |
NVESD-Science Technology Division |
University of Alberta |
Entegris |
NXP Semiconductors |
University of Bristol |
ePowersoft |
OMMIC |
University of California Santa Barbara |
ETH-Zurich |
OptiComp Corporation |
University of Florida |
EV Group E. Thallner GmbH |
OSRAM Opto Semiconductors |
University of Illinois at Urbana-Champaign |
Evans Analytical Group |
Oxford Instruments Plasma Technology |
University of Maryland |
Evatec Ltd. |
Palo Alto Research Center, Inc. |
University of Notre Dame |
Ferrotec USA |
Panasonic |
University of Parma |
Forschungsverbund Berlin eV/ FBH |
PARC Inc. |
University of Ulm - Institut of Electron Devices and Circuits |
Fraunhofer EMFT |
Philips Lumileds |
Veeco |
Fraunhofer IAF |
Picogiga |
Virginia Diodes, Inc. |
Freescale Semiconductor |
Plasma-Therm, LLC |
Vishay Intertechnology |
Freiberger Compound Materials GmbH |
QEOS Sdn Bhd |
VisIC Technologies |
Furukawa Denshi |
QuantTera |
WIN Semiconductor Corp. |
GaAstronics, Inc. |
Raytheon Co |
WirlNet, Inc. |
GAL-EL |
Recapture Metals, Inc. |
Yarmouth Materials |
GaN Systems Inc |
RF Micro Devices, Inc. |
YONEDA CORPORATION |
GCS |
RFMD |
|
Georgia Institute of Technology |
RFMD UK LTD |
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Global Communication Semiconductors |
RIM |
|
Group4 Labs, Inc. |
Rockwell Collins |
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HexaTech, Inc |
Rodeen Enterprises |
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Hitachi Cable |
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HRL Laboratories, LLC |
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Huga Optotech |